I read a comment about the IC chip packaging problem that a third of their smartest youth have fled, a third have been conscripted for the Ukraine war and are in the process of being killed, and the remainder are being ground under the heel of the machine of state.
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timeasmymeasure
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Date: 2024-03-31 07:03 pm (UTC)I read a comment about the IC chip packaging problem that a third of their smartest youth have fled, a third have been conscripted for the Ukraine war and are in the process of being killed, and the remainder are being ground under the heel of the machine of state.